WINS Solar Wafer Inspection

WINS Solar Wafer Inspection

Description

Designed for loading wafers from coin stack magazines onto conveyor line, WINS is capable of performing with a high throughput. Integrated with Data Matrix (DM) laser marking and reader, the full-fledged vision inspection functions include Geometric, Surface & Edge, Total Thickness Variation (TTV), Transflection (TF) microcrack detection, and other critical measurements. It is versatile in nature, offering minimal conversion requirements for the support of wafer sizes ranging from M6 to G12, as well as Half-cut. Additionally, SEGS GEM and Profibus are built as standard MES protocols for effortless integration. Click here to view more details.

Features

• LOADER:
  Fully automated stack loader with input up to 3 stacked magazines in 3 input slots. Each magazine supporting up to 200 wafers.
• BERNOULLI PICKUP:
  Air is discharged between the pickup surface and the wafer creating a low stress, non-suction holding to transport the wafers.
• RESISTIVITY TESTER:
  Inline, high speed resistivity testing by Eddy Current Sensors.
• MINIMUM CONTACT ALIGNMENT:
  On-the-fly alignment using low friction roller guides ensures wafers are aligned prior to entering inspection modules.
• GEOMETRIC INSPECTION:
  High accuracy measurement of the wafer geometry, edge break and pin holes inside the easy to access metrology chamber.
• SAW MARK, TTV and THICKNESS:
  Non-contact measurement of saw mark, total thickness variation (TTV) and wafer thickness using laser displacement sensors.
• SURFACE AND EDGE INSPECTION:
  On-the-fly detection of front and rear surface cosmetic defects such as stains and finger marks and chips.
• MICROCRACK INSPECTION:
  Producing homogeneous images without interference from unwanted noises to correctly detect microcracks on wafers.
• DOUBLE WAFER DETECTION:
  Consistently checking thickness at high-speed ensuring no double wafer escapee.
• BROKEN WAFER DETECTION:
  Detects severely broken wafers and purged at early stage of the sorter to ensure machine smoothness and reduce alarm stoppages.
• UNLOADER:
  Expandable sorter module with high-speed stacking. Wafers are buffered up to 40 pieces.