Wafer and Package AOI Equipment

Key Features :

• Optional5-sided and 6-sided surface inspection
• 2.5D depth technology
• Modular and flexible
• 64-bit operating system
• Xeon processor
• Throughput ranging from 20,000 uph to 50,000 uph
• Camera resolution ranging from 5 megapixels at 75fps 12 megapixels at 66fps

Application :

• Inspection after wafer dicing to detect surface defects.
• Inspection after package singulation to detect package, mark, lead and plating defects.

Wire Bond AOI Equipment

Key Features :

• Optional5-sided and 6-sided surface inspection
• 2.5D depth technology
• Modular and flexible
• 64-bit operating system
• Xeon processor
• Throughput ranging from 20,000 uph to 50,000 uph
• Camera resolution ranging from 5 megapixels at 75fps 12 megapixels at 66fps

Application :

• Inspection after wafer dicing to detect surface defects.
• Inspection after package singulation to detect package, mark, lead and plating defects.

Substrate Package AOI Equipment

Key Features :

• Line Scan Technology
• 2D Auto Inspection
• Very fast large panel Inspection
• Throughput up to 500 strips per hour
• Camera Resolution of 16000 Pixel at 47.5KHz Max Line Rate

Application :

• Inspection of lead frame substrate to detect etching, mechanical and plating defect.