Wafer and Package AOI Equipment
Key Features :
- Optional5-sided and 6-sided surface inspection
- 2.5D depth technology
- Modular and flexible
- 64-bit operating system
- Xeon processor
- Throughput ranging from 20,000 uph to 50,000 uph
- Camera resolution ranging from 5 megapixels at 75fps 12 megapixels at 66fps
Application :
- Inspection after wafer dicing to detect surface defects.
- Inspection after package singulation to detect package, mark, lead and plating defects.
Wire Bond AOI Equipment
Key Features :
- Optional5-sided and 6-sided surface inspection
- 2.5D depth technology
- Modular and flexible
- 64-bit operating system
- Xeon processor
- Throughput ranging from 20,000 uph to 50,000 uph
- Camera resolution ranging from 5 megapixels at 75fps 12 megapixels at 66fps
Application :
- Inspection after wafer dicing to detect surface defects.
- Inspection after package singulation to detect package, mark, lead and plating defects.
Substrate Package AOI Equipment
Key Features :
- Line Scan Technology
- 2D Auto Inspection
- Very fast large panel Inspection
- Throughput up to 500 strips per hour
- Camera Resolution of 16000 Pixel at 47.5KHz Max Line Rate
Application :
- Inspection of lead frame substrate to detect etching, mechanical and plating defect.