SEMICONDUCTOR / LED INSPECTION SOLUTIONS

Wafer and Package AOI Equipment

Key Features :

  • Optional5-sided and 6-sided surface inspection
  • 2.5D depth technology
  • Modular and flexible
  • 64-bit operating system
  • Xeon processor
  • Throughput ranging from 20,000 uph to 50,000 uph
  • Camera resolution ranging from 5 megapixels at 75fps 12 megapixels at 66fps

Application :

  • Inspection after wafer dicing to detect surface defects.
  • Inspection after package singulation to detect package, mark, lead and plating defects.

Wire Bond AOI Equipment

Key Features :

  • Optional5-sided and 6-sided surface inspection
  • 2.5D depth technology
  • Modular and flexible
  • 64-bit operating system
  • Xeon processor
  • Throughput ranging from 20,000 uph to 50,000 uph
  • Camera resolution ranging from 5 megapixels at 75fps 12 megapixels at 66fps

Application :

  • Inspection after wafer dicing to detect surface defects.
  • Inspection after package singulation to detect package, mark, lead and plating defects.

Substrate Package AOI Equipment

Key Features :

  • Line Scan Technology
  • 2D Auto Inspection
  • Very fast large panel Inspection
  • Throughput up to 500 strips per hour
  • Camera Resolution of 16000 Pixel at 47.5KHz Max Line Rate

Application :

  • Inspection of lead frame substrate to detect etching, mechanical and plating defect.

Enquiry

24395
This_Week1197
This_Month3739
Total24395